Panasonic Mounter CM602-L high-speed placement machine

CM602-L high-speed suction head (12 nozzles)

Installation angle: 0° ~ 359° (the angle can be set in units of 0.01°)

Mounting range: Refer to “1.4.1 Compatible board specifications”

Substrate flow direction: refer to “1.3.3 Substrate flow direction”

Mounting speed: 0.036 s (0.058 s at 0603)/per 1 chip

Mounting accuracy (under optimal conditions): 0402, 0603, 1005 Mounting ±0.04 mm: Cpk ≥ 1

Target components: component size ∗ 4 ∗ 5 0402 chips ~ 12 mm × 12 mm

Component thickness: max. 6.5 mm

Substrate exchange time:

0.9 s (substrate size: L 240 mm × W 240 mm or less)

1.8 s (substrate size: over L 240 mm × W 240 mm ~ L 330 mm × W 330 mm or less)

2.3 s (substrate size: over L 330 mm × W 330 mm ~ L 510 mm × W 460 mm or less)

CM602-L Universal suction head (8 nozzles)

Installation angle: 0° ~ 359° (the angle can be set in units of 0.01°)

Mounting range: Refer to “1.4.1 Compatible board specifications”

Substrate flow direction: refer to “1.3.3 Substrate flow direction”

Mounting speed: 0.048 s (0.065 s at 0603)/per 1 chip

Mounting accuracy (under optimal conditions): 0603, 1005 Mounting ±0.04 mm: Cpk ≥ 1QFP Mounting ±0.05 mm: Cpk ≥ 1 (24 mm × 24 mm or less) ± 0.035 mm: Cpk ≥ 1 (24 mm × 24 mm ∼32 mm × 32 mm or less)

Target components: component size ∗ 8 0603 chips ~ 32 mm × 32 mm

Component thickness ∗ 6 ∗ 7 ∗ 8 max. 8.5 mm ∗ 6

Substrate exchange time:

0.9 s (substrate size: L 240 mm × W 240 mm or less)

1.8 s (substrate size: over L 240 mm × W 240 mm ~ L 330 mm × W 330 mm or less)

2.3 s (substrate size: over L 330 mm × W 330 mm ~ L 510 mm × W 460 mm or less)

CM602-L multifunctional suction head

Installation angle: 0° ~ 359° (the angle can be set in units of 0.01°)

Mounting range: Refer to “1.4.1 Compatible board specifications”

Substrate flow direction: refer to “1.3.3 Substrate flow direction”

Mounting speed: 0.16 s (0.18 s for QFP)/per chip

Mounting accuracy (under optimal conditions): QFP mounting ±0.035 mm: Cpk ≥ 1

Target components: component size 0603 chip ~ 100 mm × 90 mm

Component thickness: max. 21 mm

Mass: up to 30 g

Substrate exchange time:

0.9 s (substrate size: L 240 mm × W 240 mm or less)

1.8 s (substrate size: over L 240 mm × W 240 mm ~ L 330 mm × W 330 mm or less)

2.3 s (substrate size: over L 330 mm × W 330 mm ~ L 510 mm × W 460 mm or less)

∗1 : The data may differ depending on the type of component.

∗2 : This is when the mounting angle is 0°, 90°, 180°, 270°. Values are different for other angles. Also, when the ambient temperature changes rapidly,

likely to be affected by it.

∗3 : 0402 chips require a dedicated nozzle and feeder.

∗4 : Parts larger than 6 mm × 6 mm have suction restrictions. (Only for even nozzles.)

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0402 ≤ component size ≤ 6 mm × 6 mm 6 mm × 6 mm < component size ≤ 12 mm × 12 mm

∗5 : Parts exceeding 6 mm × 6 mm are for reflective recognition only.

∗6 : When the component thickness exceeds 6.5 mm and is 8.5 mm or less, at 12 mm ≥ component thickness + board thickness + 1.5 mm, component size

It can be used under the condition that the size is less than 24 mm × 24 mm. In addition, short mounting nozzles are required.

∗7 : Components over 24 mm are for reflective recognition only.

∗8 : Please refer to “1.4.4 Component sizes and nozzle configurations that can be picked up” for the pick-up restrictions.