Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine

Specifications

	S10	S20
Board size(with buffer unused)	Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955)	Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455)
Board size(with input or output buffer used)	Min. L50 x W30mm to Max. L420 x W510mm	–
Board size(with input and output buffers used)	Min. L50 x W30mm to Max. L330 x W510mm	Min. L50 x W30mm to Max. L540 x W510mm
Board thickness	0.4 – 4.8mm	0.4 – 4.8mm
Board flow direction	Left to right (Std)	Left to right (Std)
Board transfer speed	Max 900mm/sec	Max 900mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond.	0.08sec/CHIP (45,000CPH)	0.08sec/CHIP (45,000CPH)
Placement accuracy A (μ+3σ)	CHIP +/-0.040mm	CHIP +/-0.040mm
Placement accuracy B (μ+3σ)	IC +/-0.025mm	IC +/-0.025mm
Placement angle	+/-180 degrees	+/-180 degrees
Z axis control / Theta axis control	AC servo motor	AC servo motor
Component height	Max 30mm^*1 (Pre-placed components: max 25mm)	Max 30mm^*1 (Pre-placed components: max 25mm)
Applicable components	0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)	0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)
Component package	8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray	8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray
Drawback check	Vacuum check and vision check	Vacuum check and vision check
Screen language	English, Chinese, Korean, Japanese	English, Chinese, Korean, Japanese
Board positioning	Board grip unit, front reference, auto conveyor width adjustment	Board grip unit, front reference, auto conveyor width adjustment
Component types	Max 90 types (8mm tape), 45 lanes x 2	Max 180 types (8mm tape), 45 lanes x 4
Transfer height	900 +/- 20mm	900 +/- 20mm
Machine dimensions, weight	L1250xD1750xH1420mm, Approx. 1,200kg	L1750xD1750xH1420mm, Approx. 1,500kg

*1 :: Board thickness + Component height = Max 30mm

Specifications and appearance are subject to change without prior notice.

Enquiry

3D hybrid placement functions

Dispense heads that can be exchanged with mount heads are newly developed. It becomes possible to make 3D placement where solder paste dispensing and component mounting can be alternately performed. Hybrid placement is now realized. The removable Dot Station can be fitted to the feeder bank.

Standard (Air pulse type) with twin nozzle

Enhancement to 3D MID

3D MID mounting (*Custom-order specification)

D MID material by JOHNAN CORPORATION SANKYO KASEI CORPORATION

Newly developed models for which dispense and placement not only on standard PCB but also on concave-convex, tilting and curved surface are also to be realized. To ensure the machine for 3D MID applications such as automotive, medical and telecommunications in future, machine structures required have already been arranged accordingly.

Large board handling capability

Multi-Conveyor system

Utilizing a laser sensor to measure the board length, providing optimum board position for efficient component placement, regardless of size or shape, for various production styles.

Long board handling capability

Maximum length of one-time clamp : 1,240mm

	With buffer unused	With input or output buffer used	With input and output buffers used
S10 board size	Min. L50 x W30～ Max. L955 x W510mm（standard）	Min. L50 x W30～ Max. L420 x W510mm	Min. L50 x W30～ Max. L330 x W510mm
S20 board size	Min. L50 x W30〜 Max. L1,455 x W510mm（standard）		Min. L50 x W30〜 Max. L540 x W510mm

Wide ranging component handling capability and high feeder capacity

Max. feeder capacity 180 lanes

S20 : S20 Max. 180 types (8mm tape conversion), 45 lanes x 4

S10 : S10 Max. 90 types (8mm tape conversion), 45 lanes x 2

ANC station

Nozzle ID automatically recognized. The standard ANC station can accommodate 24 nozzles. As a variation, an optional ANC station that can accommodate 40 nozzles is also available.

Wide ranging component handling capability

0201mm ultra-tiny chip (option) up to max. 120 x 90mm components can be handled by a single standard camera. Max. component height is 30mm (component height + board thickness), the greatest class on the market.

Color fiducial camera

Great upgrades in fiducial recognition performance! These include colorizing for fiducial recognition cameras and a newly developed lighting unit. Robust coating inspections are now a reality. (To be customized)

New head unit for higher speed placement

12-axis 2-theta head unit

Newly developed for higher speed placement is best suited for a long board production such as LED lighting.

6-axis 2-theta head unit

The 6-axis 2-theta head ideal for hybrid mounting tasks achieves the ultimate 1-head solution for mounters covering the process from dispensing to mounting to inspection.

Ultimate flexibility and fast & easy setup

CFB/CTF full compatibility

The newly developed CFB-45E as well as the existing CFB’s and CTF can be all used together on the M10 and M20 as well as on the S10 and S20.

Applicable CFB and CTF

F3 45-lane Feeder Bank Changer “CFB-45E”
F3 36-lane Feeder Bank Changer “CFB-36E”
Changeable Tray Feeder “CTF-36C”

※Fitted to S20 on the pictures below.

Options

6 axis 2-theta head
Air pulse type dispense head
Screw pump type dispense head
ANC40
0201mm chip handling capability
Dispensed dot check function(To be customized)
3D-MID
Rear fixed multi-scan camera
F3 / F1 / F2 Rear side fixed feeder bank
F3 45-lane fixed feeder bank
Safety cover, front/rear
Clamp unit for CFB/CTF
CFB-36E / CFB-45E F3 Electric Feeder Bank Changer
CTF-36C Cassette type Changeable Tray Feeder

FTF-36C Cassette type Fixed Tray Feeder
RTS-1 Removable Tray Station
Parts feeders
Rear side operation system
Rear side switches
UPS4
Conveyor extension, entrance/exit
Component setup verifier
Feeder relocatability
Waste tape box
Internal lighting
Lead coplanarity sensor
Offline software
iQvision

MAECENAS IACULIS

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ADIPISCING CONVALLIS BULUM

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	S10	S20
Board size(with buffer unused)	Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955)	Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455)
Board size(with input or output buffer used)	Min. L50 x W30mm to Max. L420 x W510mm	–
Board size(with input and output buffers used)	Min. L50 x W30mm to Max. L330 x W510mm	Min. L50 x W30mm to Max. L540 x W510mm
Board thickness	0.4 – 4.8mm	0.4 – 4.8mm
Board flow direction	Left to right (Std)	Left to right (Std)
Board transfer speed	Max 900mm/sec	Max 900mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond.	0.08sec/CHIP (45,000CPH)	0.08sec/CHIP (45,000CPH)
Placement accuracy A (μ+3σ)	CHIP +/-0.040mm	CHIP +/-0.040mm
Placement accuracy B (μ+3σ)	IC +/-0.025mm	IC +/-0.025mm
Placement angle	+/-180 degrees	+/-180 degrees
Z axis control / Theta axis control	AC servo motor	AC servo motor
Component height	Max 30mm^*1 (Pre-placed components: max 25mm)	Max 30mm^*1 (Pre-placed components: max 25mm)
Applicable components	0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)	0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)
Component package	8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray	8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray
Drawback check	Vacuum check and vision check	Vacuum check and vision check
Screen language	English, Chinese, Korean, Japanese	English, Chinese, Korean, Japanese
Board positioning	Board grip unit, front reference, auto conveyor width adjustment	Board grip unit, front reference, auto conveyor width adjustment
Component types	Max 90 types (8mm tape), 45 lanes x 2	Max 180 types (8mm tape), 45 lanes x 4
Transfer height	900 +/- 20mm	900 +/- 20mm
Machine dimensions, weight	L1250xD1750xH1420mm, Approx. 1,200kg	L1750xD1750xH1420mm, Approx. 1,500kg

Categories: SMT placement machine, Yamaha

Description
Shipping & Delivery

Description

	With buffer unused	With input or output buffer used	With input and output buffers used
S10 board size	Min. L50 x W30～ Max. L955 x W510mm（standard）	Min. L50 x W30～ Max. L420 x W510mm	Min. L50 x W30～ Max. L330 x W510mm
S20 board size	Min. L50 x W30〜 Max. L1,455 x W510mm（standard）		Min. L50 x W30〜 Max. L540 x W510mm

Shipping & Delivery

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