Fuji CP743ME specification:
Chip theoretical speed 0.068 seconds/CHIP
Mounting range 0402-19x19mm
Mounting accuracy ±0.1mm
PCB size L457×W356mm
Equipment size L4700×W1800×H1714mm
Power supply 200-480V, 3-phase 4-wire
Equipment weight 5,900kg
Description
Shipping & Delivery
MAECENAS IACULIS
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Related products
SMT placement machine Samsung placement machine SM471Plus
High-performance chip shooter with a new fly camera
· World's highest speed of 78,000CPH among chip shooters of the same class
· With two gantry dual-lane construction, supports various production modes
-
Specifications
- Alignment
- Fly Camera
- Spindle & Speed
- 2 Gantry * 10 Spindle / 78,000 CPH
- Accuracy
- ±40μm@±3σ (Chip) / ±50μm@±3σ (QFP)
- Component Range
- 0402 ~ □14mm
- Dimension
- L 1,650 x D 1,690 x H 2,045
Super High Efficiency Dual Lane Modular YRM20DL Mounter placement machine
Specifications
| Model | YRM20 | ||
|---|---|---|---|
| Super high-speed rotary RM head | High-speed general-purpose in-line HM head | Odd-shaped components in-line FM (flexible-multi) head | |
| Nozzles (per 1 head unit) | 18 | 10 | 5 |
| Applicable components | 0201mm to W12 x L12mm, Height 6.5mm or less | 0201mm to W55 x L100mm, Height 15mm or less | 03015mm to W55 x L100mm, Height 30mm or less |
| Mounting capability (under optimum conditions) | 120,000CPH Note 1 | 100,000CPH Note 1 | 35,000CPH |
| Mounting accuracy (under optimum conditions) | ±0.015mm Cpk≧1.0 Note 2 | ±0.035mm Cpk≧1.0 | |
| Number of component types | Feeder carriage exchange : Max. 128 types = 32 feeders x 4 (conversion for 8mm tape feeder) Fixed plate : Max. 128 types (conversion for 8mm tape feeder), Trays : 60 types (maximum when equipped with eATS30 x 2) | ||
| PCB dimensions | Single use : L50 x W50mm to L810 x W610mm Dual use : L50 x W50mm to L810 x W330mm | ||
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz | ||
| Air supply source | 0.45MPa or more, in clean, dry state | ||
| External dimension (excluding projections) | L1,374 x W2,102 x H1,445mm | ||
| Weight | Approx. 2,550kg (Main unit only) | ||
Yamaha Wide-Range Compact Modular YC8 Mounter placement machine
Specifications
| YC8 | ||
|---|---|---|
| Applicable PCB | L50 x W50mm to L330 x W360mm *1 | |
| Mounting accuracy | When using Yamaha's standard components | Absolute accuracy (μ+3σ):+/-0.05mm /QFP Repeatability(3σ) +/-0.03mm /QFP |
| Mounting capability | Indication | 2.5sec/component (Cycle time from a pickup to mounting with recognition) |
| Applicable components | 4 x 4mm to 100 x 100mm *2 (Some components larger than 45 x 45mm ane conditional) Maximum components heights 45mm Maximum payload 1kg | |
| Component supply configuration: Number of component types | Tape reel : MAX. 28 types (8mm width) Tray : MAX. 15 trays Stick | |
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz | |
| Air supply source | 0.45MPa or more, in clean, dry states | |
| External dimension (excluding projections) | L 880 x W1,440 x H1,445mm (Main unit only) L 880 x W1,755 x H1,500mm (When ATS15 is installed) | |
| Weight | Approx. 1,000kg (Main unit only) ATS15 : Approx. 120kg | |
- *1
- Please consult us separately for maximum board sizes.
- *2
- Consult us separately regarding component sizes outside the specifications.
- Specifications and appearance are subject to change without prior notice.
Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine
Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.
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