Fuji CP743ME specification:
Chip theoretical speed 0.068 seconds/CHIP
Mounting range 0402-19x19mm
Mounting accuracy ±0.1mm
PCB size L457×W356mm
Equipment size L4700×W1800×H1714mm
Power supply 200-480V, 3-phase 4-wire
Equipment weight 5,900kg
Description
Shipping & Delivery
MAECENAS IACULIS
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Samsuang Hanwha DECAN F2
Specifications
- Alignment
- Fly Camera, Fix Camera
- Spindle & Speed
- 2 Gantry * 10 Spindles / 80,000 CPH
- Accuracy
- ±40µm Cpk≥1.0 (0402 (01005 inch) chip) /±30µm Cpk≥1.0 (IC, Stage Vision)
- Component Range
- Fly: 0402 ~ □16 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
- Dimension
- L 1,430 x D 1,740 x H 1,995
Yamaha High-efficiency Modular Z:LEX YSM20R Mounter placement machine
Specifications
| Model | YSM20R |
|---|---|
| Applicable PCB | Single lane L810 x W490 to L50 x W50 Dual stage Note: For X-axis 2-beam option only 1PCB conveyance: L810 x W490 to L50 x W50 2PCB conveyance: L380 x W490 to L50 x W50 |
| Head / Applicable components | High-Speed Multi (HM) Head * 0201mm to W55 x L100mm, Height 15mm or less Odd-shaped components (FM: Flexible Multi) head: 03015mm to W55 x L100mm, Height 28mm or less |
| Mounting capability (under optimum conditions as defined by Yamaha Motor) | X axis 2-beam: High-speed multi-purpose (HM: High-speed Multi) head x 2 95,000CPH |
| Mounting accuracy | ±0.035mm (±0.025mm) Cpk≧1.0 (3σ) (under optimum conditions as defined by Yamaha Motor when standard evaluation materials are used) |
| Number of component Types | Fixed plate: Max. 140 types (conversion for 8mm tape feeder) Feeder carriage exchange: Max. 128 types (conversion for 8mm tape feeder) Trays for 30 types (Fixed type: max., when fitted with sATS30) and 10 types (Carriage type: max., when fitted with cATS10) |
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz |
| Air supply source | 0.45MPa or more, in clean, dry state |
| External dimension (excluding projections) | L 1,374 x W 1,857 x H1,445mm (Main unit only) |
| Weight | Approx. 2,050kg (Main unit only) |
Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine
Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.
Panasonic NPM-W2 Multifunctional Mounter placement machine
Product Features of Panasonic NPM-W2 Multi-Function Mounter
1. Install & inspect a complete system to achieve efficient and high-quality production
To match the actual installation requirements, you can choose high-yield or high-precision mode
2. Can correspond to larger substrates and large components
Correspondingly, on a large substrate of 750×550 mm, the component range is also expanded to L150×W25×T30mm
3. Double-track installation (select specifications) to achieve high productivity per unit area
According to the production substrate, you can choose independent mounting, alternate mounting, mixed mounting and other mounting methods
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