CM602-L high-speed suction head (12 nozzles)
Installation angle: 0° ~ 359° (the angle can be set in units of 0.01°)
Mounting range: Refer to “1.4.1 Compatible board specifications”
Substrate flow direction: refer to “1.3.3 Substrate flow direction”
Mounting speed: 0.036 s (0.058 s at 0603)/per 1 chip
Mounting accuracy (under optimal conditions): 0402, 0603, 1005 Mounting ±0.04 mm: Cpk ≥ 1
Target components: component size ∗ 4 ∗ 5 0402 chips ~ 12 mm × 12 mm
Component thickness: max. 6.5 mm
Substrate exchange time:
0.9 s (substrate size: L 240 mm × W 240 mm or less)
1.8 s (substrate size: over L 240 mm × W 240 mm ~ L 330 mm × W 330 mm or less)
2.3 s (substrate size: over L 330 mm × W 330 mm ~ L 510 mm × W 460 mm or less)
CM602-L Universal suction head (8 nozzles)
Installation angle: 0° ~ 359° (the angle can be set in units of 0.01°)
Mounting range: Refer to “1.4.1 Compatible board specifications”
Substrate flow direction: refer to “1.3.3 Substrate flow direction”
Mounting speed: 0.048 s (0.065 s at 0603)/per 1 chip
Mounting accuracy (under optimal conditions): 0603, 1005 Mounting ±0.04 mm: Cpk ≥ 1QFP Mounting ±0.05 mm: Cpk ≥ 1 (24 mm × 24 mm or less) ± 0.035 mm: Cpk ≥ 1 (24 mm × 24 mm ∼32 mm × 32 mm or less)
Target components: component size ∗ 8 0603 chips ~ 32 mm × 32 mm
Component thickness ∗ 6 ∗ 7 ∗ 8 max. 8.5 mm ∗ 6
Substrate exchange time:
0.9 s (substrate size: L 240 mm × W 240 mm or less)
1.8 s (substrate size: over L 240 mm × W 240 mm ~ L 330 mm × W 330 mm or less)
2.3 s (substrate size: over L 330 mm × W 330 mm ~ L 510 mm × W 460 mm or less)
CM602-L multifunctional suction head
Installation angle: 0° ~ 359° (the angle can be set in units of 0.01°)
Mounting range: Refer to “1.4.1 Compatible board specifications”
Substrate flow direction: refer to “1.3.3 Substrate flow direction”
Mounting speed: 0.16 s (0.18 s for QFP)/per chip
Mounting accuracy (under optimal conditions): QFP mounting ±0.035 mm: Cpk ≥ 1
Target components: component size 0603 chip ~ 100 mm × 90 mm
Component thickness: max. 21 mm
Mass: up to 30 g
Substrate exchange time:
0.9 s (substrate size: L 240 mm × W 240 mm or less)
1.8 s (substrate size: over L 240 mm × W 240 mm ~ L 330 mm × W 330 mm or less)
2.3 s (substrate size: over L 330 mm × W 330 mm ~ L 510 mm × W 460 mm or less)
∗1 : The data may differ depending on the type of component.
∗2 : This is when the mounting angle is 0°, 90°, 180°, 270°. Values are different for other angles. Also, when the ambient temperature changes rapidly,
likely to be affected by it.
∗3 : 0402 chips require a dedicated nozzle and feeder.
∗4 : Parts larger than 6 mm × 6 mm have suction restrictions. (Only for even nozzles.)
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0402 ≤ component size ≤ 6 mm × 6 mm 6 mm × 6 mm < component size ≤ 12 mm × 12 mm
∗5 : Parts exceeding 6 mm × 6 mm are for reflective recognition only.
∗6 : When the component thickness exceeds 6.5 mm and is 8.5 mm or less, at 12 mm ≥ component thickness + board thickness + 1.5 mm, component size
It can be used under the condition that the size is less than 24 mm × 24 mm. In addition, short mounting nozzles are required.
∗7 : Components over 24 mm are for reflective recognition only.
∗8 : Please refer to “1.4.4 Component sizes and nozzle configurations that can be picked up” for the pick-up restrictions.
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