ASM Siemens Mounter HS50
1. Available parts size: from 0201 (0.25mm x 0.5mm) to 18.7mm x 18.7mm.
2. Types of parts that can be attached: Resistor, Capacitor, BGA, u BGA, QFP, CSP, PLCC, Connector and other special-shaped parts.
3. The types of parts that can be loaded at one time: 144 kinds (8mm parts).
4. SMT speed: 50,000 parts/hour.
5. Chip accuracy: ±0.075 (at 4 sigma).
6. Material station: 144
7. The size of the PCB that can be attached:
In single track: PCB from 50mm x 50mm to 368mm x 460mm;
In double track: PCB from 50mm x 50mm to 368mm x 216mm.
7. PCB thickness that can be pasted: 0.5mm to 4.5mm.
8. PCB weight: 3 kg.
9. Power consumption: 4 KW (at full load).
10. Air consumption: 950 liters/min (at pressure from 6.5 ba to 10 ba).
11. Weight: 3.5 tons.
12. Dimensions: 2.4m * 2.9m * 1.8m (length *width * height)
SMT placement machine Siemens ASM SIPLACE HS50 high-speed placement machine
1. The size of the parts that can be attached: from 0201 (0.25mmx0.5mm) to 18.7mmx18.7mm.
2. The types of parts that can be loaded at one time: 144 types (8mm parts).
3. SMT speed: 50,000 parts/hour.
4. Chip accuracy: ±0.075 (at 4sigma).
5. Material station: 144
Description
Shipping & Delivery
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Specifications
- Alignment
- Fly Camera, Fix Camera
- Spindle & Speed
- 2 Gantry * 10 Spindles / 80,000 CPH
- Accuracy
- ±40µm Cpk≥1.0 (0402 (01005 inch) chip) /±30µm Cpk≥1.0 (IC, Stage Vision)
- Component Range
- Fly: 0402 ~ □16 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
- Dimension
- L 1,430 x D 1,740 x H 1,995
Panasonic Mounter CM602-L high-speed placement machine
Control mode: microcomputer mode
External memory: Manage data at PT∗4. Each set of data requires about 1MB. (1 type is required for each 1 type 3.5 2HD floppy disk)
Program data: Points Max. 10000 points
CM602 power supply
Power supply for normal use: 3-phase AC 200 V/ 220 V ±10 V, 3-phase AC 380 V/ 400 V/ 420 V/ 480 V ±20 V Frequency: 50/60 Hz
Power supply for HUB ∗ 3: Single-phase AC 100 V ~ AC 240 V Frequency: 50/60 Hz
Rated capacity: main machine 4.0 kVA / HUB power supply ∗ 3: 140 VA
Supply air pressure: 0.49 MPa ~ 0.78 MPa (operating air pressure is 0.49 MPa ~ 0.54 MPa)
Supply air volume: 170 L/min (A.N.R.)
Dimensions: 2350 mm (W) × 2690 mm (D) × 1430 mm (H) (excluding 3-section signal tower and color touch panel)
quality:
Mass of the main engine: 3400 kg (140 kg for the standard configuration without the overall exchange trolley)
Overall exchange trolley mass: 140 kg (per 1)
Direct tray feeder mass: 195 kg (per 1 unit)
Standard composition mass: 3960 kg (1 main engine, 4 overall exchange trolleys)
Environmental conditions: Temperature: 10°C ~ 35°C Humidity: 25% RH ~ 75% RH (but water vapor does not condense)
Transport and storage conditions: Temperature: −20°C ~ 60°C Humidity: Below 75 % RH (but water vapor does not condense)
Altitude: from 0 m above sea level to below 1000 m
Noise: < 70dB (A)
SMT placement machine ASM Siemens placement machine TX2i/TX2/TX1
Introduction to ASM Siemens Mounter TX2i: ASM Siemens Mounter TX2i: Provide high performance and high precision in a very small footprint. The ASM Siemens Mounter TX2i mounter module sets a new benchmark for mass production. No other placement solution can achieve 25 µm @ 3 sigma accuracy at speeds up to 96,000 cph in such a small footprint (only 1m x 2.3m).
Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine
Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.
Panasonic Mounter CM402-L Modular Super High Speed placement machine
Model name: CM402-L
Substrate size: L50mm×W50mm～L510mm×W460mm
Substrate replacement time: 0.9s (when the substrate length is below 240mm and under the best conditions)
Power supply*1: three-phase AC200V, 3.5kVA
Air pressure source*2: 0.49MPa, 150L/min (A.N.R.)
Equipment size: W2350mm×D2690mm×H1430mm*3
Weight*4: 3000kg
High-speed placement head
Mounting fastest speed: 0.06s/chip (Type A)
Mounting accuracy: ±50μm/chip (Cpk≧1)
Component size: 0603 chip~L24mm×W24mm
Multifunctional placement head
Mounting fastest speed: 0.21s/QFP (Type B)
Mounting accuracy: ±35μm/QFP (Cpk≧1)
Component size: 0603 chip~L100mm×W90mm
Panasonic NPM-W2 Multifunctional Mounter placement machine
Product Features of Panasonic NPM-W2 Multi-Function Mounter
1. Install & inspect a complete system to achieve efficient and high-quality production
To match the actual installation requirements, you can choose high-yield or high-precision mode
2. Can correspond to larger substrates and large components
Correspondingly, on a large substrate of 750×550 mm, the component range is also expanded to L150×W25×T30mm
3. Double-track installation (select specifications) to achieve high productivity per unit area
According to the production substrate, you can choose independent mounting, alternate mounting, mixed mounting and other mounting methods
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