Yadis YDS-F1 Automatic High Speed Mounter Pick&Place machine
Features:
1. It is suitable for mounting models such as 0.5M, 1M, 1.2M, LEDT8/T5 fluorescent lamps, flexible light strips, diffuse reflection, outdoor screens, light heads, etc. The placement heads of this machine are divided into two groups, 17 in each group Suction nozzles, Y1 and Y2 can be attached at the same time or individually.
2. The whole body adopts precision welding, and the beam adopts high-strength cast iron structure, which has good seismic performance.
3. The machine is driven by imported servo motor, with high precision and fast speed.
4. Low maintenance cost, simple operation, operators only need to go through simple training to start production.
5. The machine adopts double electric feeders to feed materials.
Description
Shipping & Delivery
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Yamaha Ultra-High-Speed Modular Z:TA-R YSM40R Mounter placement machine
Specifications
| Z:TA-R YSM40R | ||
|---|---|---|
| 4-Beam, 4-Head Spec. (YSM40R-4) | ||
| Applicable PCB | L700×W460mm to L50×W50mm | |
| Mounting capability (under optimum conditions as defined by Yamaha Motor) | 200,000CPH (When using RS head) | |
| Applicable components | Ultra-High-Speed (RS) Head | 0201mm* to □6.5mm (Height 2.0mm or less) *option |
| Multi (MU) Head | 03015mm to 45×60mm (Height 15mm or less) | |
| Mounting accuracy (Under optimum conditions as defined by Yamaha Motor when standard evaluation materials are used) | +/-35μm (25μm) Cpk ≧1.0 (3σ) | |
| Number of component types * 8mm width tape conversion | Max. 80 feeders with RS heads Max. 88 feeders with MU heads Max. 84 feeders with RS x 2 + MU x 2 heads | |
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% | |
| Air supply source | 0.45MPa or more, in clean, dry state | |
| External dimension | L1,000×W2,100×H1,550mm (excluding projections) | |
| Weight | Approx. 2,100 kg | |
Samsung Hanwha High Speed Mounter DECANS2
Specifications
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- Fly Camera, Fix Camera
- Spindle & Speed
- 2 Gantry * 10 Spindle / 92,000 CPH
- Accuracy
- ±28 μm @ Cpk ≥ 1.0 (03015 Chip) / ±25 μm @ Cpk ≥ 1.0(IC)
- Component Range
- Fly: 03015 ~ □12 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
- Dimension
- L 1,430 x D 1,740 x H 1,995
Panasonic CM202 placement machine Mounter
Main parameters of CM202 placement machine:
2004 equipment
PCB size: 460mm×360mm
Component range that can be attached: 0201 to 24mmQFPS
Material station: 104
Theoretical placement speed: 0.088s/chip 40909 pieces/hour
Mounting accuracy: ±0.05mm
Dimensions and Weight: 2,350(L) X 1,950(D) X 1,430(H)mm&2,800kg
Power supply and air source: 3P/200V±10V/3KVa
SMT placement machine Samsung placement machine SM471Plus
High-performance chip shooter with a new fly camera
· World's highest speed of 78,000CPH among chip shooters of the same class
· With two gantry dual-lane construction, supports various production modes
-
Specifications
- Alignment
- Fly Camera
- Spindle & Speed
- 2 Gantry * 10 Spindle / 78,000 CPH
- Accuracy
- ±40μm@±3σ (Chip) / ±50μm@±3σ (QFP)
- Component Range
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Panasonic Mounter NPM-TT2 multifunctional production system placement machine
The Panasonic Mounter NPM-TT2 is a line configuration capable of achieving both high productivity per unit area and versatility *When directly connecting the NPM-W2, an M-size double-track conveyor belt (optional) is required. The placement head (8-nozzle placement head, 3-nozzle placement head - you can choose the general-purpose 8-nozzle placement head or the 3-nozzle placement head with special-shaped component capability) The specification of the supply part can be selected .change. By reorganizing the tray feeder/exchange trolley, the line configuration can be adapted to the component supply form. Using a multi-functional recognition camera, the recognition and inspection of the height direction of the components can be realized at a high speed, and it can carry out stable and high-speed mounting of special-shaped components) Alternate mounting and independent mounting correspondence
——(can choose the best mounting method corresponding to the production substrate)
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