Specification
| Board size | M size (330×250mm) | yes | |
|---|---|---|---|
| L size (4FFF10×360mm) | yes | ||
| L-Wide size (510×360mm) *1 | yes | ||
| XL size (610×560mm) | yes | ||
| Applicability to long PWB (M size)*2 | 650×250mm | ||
| Applicability to long PWB (L size)*2 | 800×360mm | ||
| Applicability to long PWB (L-Wide size)*2 | 1,010×360mm | ||
| Applicability to long PWB (XL size)*2 | 1,210×560mm | ||
| Component height | 6mm | yes | |
| 12mm | yes | ||
| Component size | Laser recognition | 0402(01005) ~ □33.5mm | |
| Vision recognition | Standard camera |  3mm*3 ~ □33.5mm |
|
| High-resolution camera | 1.0×0.5mm*4 ~ □20mm |
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| Placement speed | Chip | Optimum | 23,500CPH |
| IPC9850 | 18,500CPH | ||
| IC *5 | 9,000CPH *6 |
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| Placement accuracy | Laser recognition | ±0.05 mm (±3σ) | |
| Vision recognition | ±0.04mm | ||
| Feeder inputs | Max.160 in case of 8mm tape (on a Electric double tape feeder)*7 |
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*1 L-Wide size is optional
*2 Applicability to long PWB is optional.
*3 When using MNVC. (option)
*4 KE-3010A ： When using both high-resolution camera and MNVC. (option)
*5 Effective tact : The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board. (CPH=number of components placed for one hour)
*6 Estimated value when using MNVC and picking up components simultaneous with all nozzles.
MNVC is option in the KE-3010A.
*7 When using Electric double tape feeder EF08HD.
* PWB size XL will be KE-3010
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