| 朤科S500有导线灯带贴片机 | |
| 型号/Model | S500 |
| 外观/Appearance | |
| PCB | |
| PCB尺寸/PCB Size | 最大：1200*320mm, 最小：90*90mm Max: 1200*320mm, Min: 90*90mm |
| PCB厚度/PCB thickness | 0.5-5mm |
| PCB 定位/PCB Positioning | CCD视觉，Mark点定位 CCD visual, Mark point positioning |
| PCB传送速度/PCB Transmitting Speed | 320mm/s |
| PCB传送方向/
PCB Transmitting Direction |
前→后 Front to Back |
| 贴装/Mounting | |
| 贴装头驱动/Mounting Head Driver | 磁悬浮直线电机 Maglev linear motor |
| 贴装头数量/Mounting Head Amount | 2头 2Heads |
| 吸嘴数量/Nozzles Amount | 每头32个，共计64个 32 Pcs per head, totally 64Pcs |
| 贴装精度/Mounting Accuracy | ±0.03mm |
| 贴片速度/Mounting Speed | 250000 – 270000 CPH |
| 重复精度/Repeat Accuracy | ±0.01mm |
| 最小贴片间距/Min Mounting Gap | 6.5mm |
| 贴片元件范围/Components Range | 0805,1206,2835,3014,3528,5050,5630,5730,RGB等LED带装料; 0805,1206,2835,3014,3528,5050,5630,5730, RGB and other LED stripped material. |
| 贴片元件高度/Component Height | 10mm |
| 飞达数量/Feeder Amount | 48/64 Pcs |
| 飞达种类/Feeder Type | 双马达电动飞达 Dual motor electric feeder |
| 贴装模式/Mounting Type | 群取群贴 Group picking and group placing |
| 进出板方式/PCB Input/Output Method | 皮带传送 belt transfer |
| 导轨尺寸 Rail size | 1300*330mm |
| 系统/System | |
| 电脑系统/Computer System | Windows |
| 操作软件/Operating Software | 朤科独立开发 Independent R&D by Langke |
| 视觉系统/Visual System | 5套光学相机(可选装视觉飞拍，漏料报警)
5 sets of optical camera（option: visual inspection for missing component alarm） |
| 运动控制模块/Motion Control Module | 固高/高川运动控制卡 Googol/Gaochuan Motion control card |
| X、Y轴驱动 | 日本富士电机 Japanese Fuji Servo Motor |
| 工作要求/Working Requirement | |
| 电源/Power | 交流50HZ，三相380V±10%; 380V AC/50Hz/3 Phase |
| 最大耗电量/Max Power | 5.0 KW |
| 气压/Air Pressure | 0.5-0.8Mpa |
| 工作环境温度/Temperature | 23℃±3 |
| 外形/Dimension | |
| 外形尺寸/Dimension | 2580*2500*1550mm |
| 重量/Weight | 2197KG |
Description
Shipping & Delivery
MAECENAS IACULIS
Vestibulum curae torquent diam diam commodo parturient penatibus nunc dui adipiscing convallis bulum parturient suspendisse parturient a.Parturient in parturient scelerisque nibh lectus quam a natoque adipiscing a vestibulum hendrerit et pharetra fames nunc natoque dui.
ADIPISCING CONVALLIS BULUM
- Vestibulum penatibus nunc dui adipiscing convallis bulum parturient suspendisse.
- Abitur parturient praesent lectus quam a natoque adipiscing a vestibulum hendre.
- Diam parturient dictumst parturient scelerisque nibh lectus.
Scelerisque adipiscing bibendum sem vestibulum et in a a a purus lectus faucibus lobortis tincidunt purus lectus nisl class eros.Condimentum a et ullamcorper dictumst mus et tristique elementum nam inceptos hac parturient scelerisque vestibulum amet elit ut volutpat.
Related products
Yamaha Compact High-speed Modular YSM10 Mounter placement machine
| YSM10 | ||
|---|---|---|
| Applicable PCB | L 510 x W 460mm - L 50 x W 50mm Note : Available in lengths up to L950mm as an option. | |
| Applicable components | 03015mm to W55 x L100mm (For parts sizes larger the width 45mm, recognition of parts is divided into sections.), Height 15mm or less Note : A multi camera (option) is required for part heights exceeding 6.5mm or part sizes exceeding 12mm | |
| Mounting capability | HM head (10 nozzle) specification : 46,000CPH (under optimum conditions as defined by Yamaha Motor) HM 5 head (5 nozzle) specification : 31,000CPH (under optimum conditions as defined by Yamaha Motor) | |
| Mounting accuracy (Under optimum conditions as defined by Yamaha Motor when standard evaluation materials are used) | +/-0.035mm (+/-0.025mm) Cpk 1.0 (3σ) | |
| Number of component types | Fixed plate : Max. 96 types (conversion for 8mm tape feeder) Note 1 Tray : 15 types (maximum when equipped with sATS15, JEDEC) | |
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz | |
| Air supply source | 0.45MPa or more, in clean, dry state | |
| External dimension | L1,254 x W1,440 x H1,445mm | |
| Weight | Approx. 1,270kg | |
SMT placement machine Samsung placement machine SM471Plus
High-performance chip shooter with a new fly camera
· World's highest speed of 78,000CPH among chip shooters of the same class
· With two gantry dual-lane construction, supports various production modes
-
Specifications
- Alignment
- Fly Camera
- Spindle & Speed
- 2 Gantry * 10 Spindle / 78,000 CPH
- Accuracy
- ±40μm@±3σ (Chip) / ±50μm@±3σ (QFP)
- Component Range
- 0402 ~ □14mm
- Dimension
- L 1,650 x D 1,690 x H 2,045
Panasonic CM202 placement machine Mounter
Main parameters of CM202 placement machine:
2004 equipment
PCB size: 460mm×360mm
Component range that can be attached: 0201 to 24mmQFPS
Material station: 104
Theoretical placement speed: 0.088s/chip 40909 pieces/hour
Mounting accuracy: ±0.05mm
Dimensions and Weight: 2,350(L) X 1,950(D) X 1,430(H)mm&2,800kg
Power supply and air source: 3P/200V±10V/3KVa
SMT placement machine ASM Siemens placement machine TX2i/TX2/TX1
Introduction to ASM Siemens Mounter TX2i: ASM Siemens Mounter TX2i: Provide high performance and high precision in a very small footprint. The ASM Siemens Mounter TX2i mounter module sets a new benchmark for mass production. No other placement solution can achieve 25 µm @ 3 sigma accuracy at speeds up to 96,000 cph in such a small footprint (only 1m x 2.3m).
Samsung Hanwha High Speed Mounter DECANS2
Specifications
- Alignment
- Fly Camera, Fix Camera
- Spindle & Speed
- 2 Gantry * 10 Spindle / 92,000 CPH
- Accuracy
- ±28 μm @ Cpk ≥ 1.0 (03015 Chip) / ±25 μm @ Cpk ≥ 1.0(IC)
- Component Range
- Fly: 03015 ~ □12 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
- Dimension
- L 1,430 x D 1,740 x H 1,995
Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine
Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.
Reviews
There are no reviews yet.