SMT Panasonics BM123 / BM221 / BM231 / MSF 16MM Electronics Feeder for SMT PICK AND PLACE MACHINE
SMT Panasonics BM123 / BM221 / BM231 / MSF 16MM Electronics Feeder for SMT PICK AND PLACE MACHINE
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Related products
Yamaha Compact High-speed Modular YSM10 Mounter placement machine
| YSM10 | ||
|---|---|---|
| Applicable PCB | L 510 x W 460mm - L 50 x W 50mm Note : Available in lengths up to L950mm as an option. | |
| Applicable components | 03015mm to W55 x L100mm (For parts sizes larger the width 45mm, recognition of parts is divided into sections.), Height 15mm or less Note : A multi camera (option) is required for part heights exceeding 6.5mm or part sizes exceeding 12mm | |
| Mounting capability | HM head (10 nozzle) specification : 46,000CPH (under optimum conditions as defined by Yamaha Motor) HM 5 head (5 nozzle) specification : 31,000CPH (under optimum conditions as defined by Yamaha Motor) | |
| Mounting accuracy (Under optimum conditions as defined by Yamaha Motor when standard evaluation materials are used) | +/-0.035mm (+/-0.025mm) Cpk 1.0 (3σ) | |
| Number of component types | Fixed plate : Max. 96 types (conversion for 8mm tape feeder) Note 1 Tray : 15 types (maximum when equipped with sATS15, JEDEC) | |
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz | |
| Air supply source | 0.45MPa or more, in clean, dry state | |
| External dimension | L1,254 x W1,440 x H1,445mm | |
| Weight | Approx. 1,270kg | |
Panasonic NPM-W2 Multifunctional Mounter placement machine
Product Features of Panasonic NPM-W2 Multi-Function Mounter
1. Install & inspect a complete system to achieve efficient and high-quality production
To match the actual installation requirements, you can choose high-yield or high-precision mode
2. Can correspond to larger substrates and large components
Correspondingly, on a large substrate of 750×550 mm, the component range is also expanded to L150×W25×T30mm
3. Double-track installation (select specifications) to achieve high productivity per unit area
According to the production substrate, you can choose independent mounting, alternate mounting, mixed mounting and other mounting methods
Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine
Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.
SMT placement machine ASM Siemens placement machine TX2i/TX2/TX1
Introduction to ASM Siemens Mounter TX2i: ASM Siemens Mounter TX2i: Provide high performance and high precision in a very small footprint. The ASM Siemens Mounter TX2i mounter module sets a new benchmark for mass production. No other placement solution can achieve 25 µm @ 3 sigma accuracy at speeds up to 96,000 cph in such a small footprint (only 1m x 2.3m).
Samsung Hanwha High Speed Mounter DECANS2
Specifications
- Alignment
- Fly Camera, Fix Camera
- Spindle & Speed
- 2 Gantry * 10 Spindle / 92,000 CPH
- Accuracy
- ±28 μm @ Cpk ≥ 1.0 (03015 Chip) / ±25 μm @ Cpk ≥ 1.0(IC)
- Component Range
- Fly: 03015 ~ □12 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
- Dimension
- L 1,430 x D 1,740 x H 1,995
Panasonic Mounter NPM-TT2 multifunctional production system placement machine
The Panasonic Mounter NPM-TT2 is a line configuration capable of achieving both high productivity per unit area and versatility *When directly connecting the NPM-W2, an M-size double-track conveyor belt (optional) is required. The placement head (8-nozzle placement head, 3-nozzle placement head - you can choose the general-purpose 8-nozzle placement head or the 3-nozzle placement head with special-shaped component capability) The specification of the supply part can be selected .change. By reorganizing the tray feeder/exchange trolley, the line configuration can be adapted to the component supply form. Using a multi-functional recognition camera, the recognition and inspection of the height direction of the components can be realized at a high speed, and it can carry out stable and high-speed mounting of special-shaped components) Alternate mounting and independent mounting correspondence
——(can choose the best mounting method corresponding to the production substrate)
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