FUJI XP141 XPF 1.0MM Nozzle for SMT Pick and Place Machine
Description
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Super High Efficiency Dual Lane Modular YRM20DL Mounter placement machine
Specifications
| Model | YRM20 | ||
|---|---|---|---|
| Super high-speed rotary RM head | High-speed general-purpose in-line HM head | Odd-shaped components in-line FM (flexible-multi) head | |
| Nozzles (per 1 head unit) | 18 | 10 | 5 |
| Applicable components | 0201mm to W12 x L12mm, Height 6.5mm or less | 0201mm to W55 x L100mm, Height 15mm or less | 03015mm to W55 x L100mm, Height 30mm or less |
| Mounting capability (under optimum conditions) | 120,000CPH Note 1 | 100,000CPH Note 1 | 35,000CPH |
| Mounting accuracy (under optimum conditions) | ±0.015mm Cpk≧1.0 Note 2 | ±0.035mm Cpk≧1.0 | |
| Number of component types | Feeder carriage exchange : Max. 128 types = 32 feeders x 4 (conversion for 8mm tape feeder) Fixed plate : Max. 128 types (conversion for 8mm tape feeder), Trays : 60 types (maximum when equipped with eATS30 x 2) | ||
| PCB dimensions | Single use : L50 x W50mm to L810 x W610mm Dual use : L50 x W50mm to L810 x W330mm | ||
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz | ||
| Air supply source | 0.45MPa or more, in clean, dry state | ||
| External dimension (excluding projections) | L1,374 x W2,102 x H1,445mm | ||
| Weight | Approx. 2,550kg (Main unit only) | ||
Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine
Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.
SMT placement machine ASM Siemens placement machine TX2i/TX2/TX1
Introduction to ASM Siemens Mounter TX2i: ASM Siemens Mounter TX2i: Provide high performance and high precision in a very small footprint. The ASM Siemens Mounter TX2i mounter module sets a new benchmark for mass production. No other placement solution can achieve 25 µm @ 3 sigma accuracy at speeds up to 96,000 cph in such a small footprint (only 1m x 2.3m).
Panasonic NPM-W2 Multifunctional Mounter placement machine
Product Features of Panasonic NPM-W2 Multi-Function Mounter
1. Install & inspect a complete system to achieve efficient and high-quality production
To match the actual installation requirements, you can choose high-yield or high-precision mode
2. Can correspond to larger substrates and large components
Correspondingly, on a large substrate of 750×550 mm, the component range is also expanded to L150×W25×T30mm
3. Double-track installation (select specifications) to achieve high productivity per unit area
According to the production substrate, you can choose independent mounting, alternate mounting, mixed mounting and other mounting methods
SMT placement machine Samsung placement machine SM471Plus
High-performance chip shooter with a new fly camera
· World's highest speed of 78,000CPH among chip shooters of the same class
· With two gantry dual-lane construction, supports various production modes
-
Specifications
- Alignment
- Fly Camera
- Spindle & Speed
- 2 Gantry * 10 Spindle / 78,000 CPH
- Accuracy
- ±40μm@±3σ (Chip) / ±50μm@±3σ (QFP)
- Component Range
- 0402 ~ □14mm
- Dimension
- L 1,650 x D 1,690 x H 2,045
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