FUJI XP141 XPF 1.0MM Nozzle for SMT Pick and Place Machine
Description
Shipping & Delivery
MAECENAS IACULIS
Vestibulum curae torquent diam diam commodo parturient penatibus nunc dui adipiscing convallis bulum parturient suspendisse parturient a.Parturient in parturient scelerisque nibh lectus quam a natoque adipiscing a vestibulum hendrerit et pharetra fames nunc natoque dui.
ADIPISCING CONVALLIS BULUM
- Vestibulum penatibus nunc dui adipiscing convallis bulum parturient suspendisse.
- Abitur parturient praesent lectus quam a natoque adipiscing a vestibulum hendre.
- Diam parturient dictumst parturient scelerisque nibh lectus.
Scelerisque adipiscing bibendum sem vestibulum et in a a a purus lectus faucibus lobortis tincidunt purus lectus nisl class eros.Condimentum a et ullamcorper dictumst mus et tristique elementum nam inceptos hac parturient scelerisque vestibulum amet elit ut volutpat.
Related products
Yamaha Premium Modular Σ-F8S Mounter placement machine
Specifications
| Σ-F8S | |
|---|---|
| Applicable PCB | Single lane : L330 x W250 to L50 x W50mm (Option : L381 x W510 to L50 x W50mm) Dual lane : L330 x W250 to L50 x W50mm |
| Head/Applicable components | High-speed head : 0201mm CHIP to 4.3 x 3.4mm, Height 2.0mm or less High-speed multi-purpose head : 03015mm CHIP to 33mm square, Height 12.7mm or less |
| Mounting capability | High-speed head x 4 specs : 150,000CPH (Dual lane) 136,000CPH (Single lane) |
| Mounting accuracy (Under optimum conditions as defined by Yamaha Motor when standard evaluation materials are used) | High-speed head : 0201mm/03015mm : ±25μm (3σ) (140,000CPH) 0402mm/0603mm : ±36μm (3σ) (150,000CPH) |
| Number of component types | Max.80 types (conversion for 8mm tape feeder) |
| Power supply | 3-Phase AC200V ±10% 50/60Hz |
| Air supply source | 0.45 to 0.69MPa (4.6 to 7kgf/cm2) |
| External dimension | L 1,280 x W 2,240 x H 1,450mm (excluding projections) |
| Weight | Approx. 1,940kg |
- Specifications and appearance are subject to change without prior notice.
Samsung Hanwha High Speed Mounter DECANS2
Specifications
- Alignment
- Fly Camera, Fix Camera
- Spindle & Speed
- 2 Gantry * 10 Spindle / 92,000 CPH
- Accuracy
- ±28 μm @ Cpk ≥ 1.0 (03015 Chip) / ±25 μm @ Cpk ≥ 1.0(IC)
- Component Range
- Fly: 03015 ~ □12 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
- Dimension
- L 1,430 x D 1,740 x H 1,995
Hanwha High Speed General Mounter DECAN L2
Specifications
- Alignment
- Fly Camera, Fix Camera
- Spindle & Speed
- 2 Gantry * 6 Spindle / 56,000 CPH
- Accuracy
- ±40µm Cpk≥1.0 (0402 (01005 inch) chip) /±30µm Cpk≥1.0 (IC, Stage Vision)
- Component Range
- Fly: 0402 ~ □21 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
- Dimension
- L 1,430 x D 1,740 x H 1,995
Yamaha Wide-Range Compact Modular YC8 Mounter placement machine
Specifications
| YC8 | ||
|---|---|---|
| Applicable PCB | L50 x W50mm to L330 x W360mm *1 | |
| Mounting accuracy | When using Yamaha's standard components | Absolute accuracy (μ+3σ):+/-0.05mm /QFP Repeatability(3σ) +/-0.03mm /QFP |
| Mounting capability | Indication | 2.5sec/component (Cycle time from a pickup to mounting with recognition) |
| Applicable components | 4 x 4mm to 100 x 100mm *2 (Some components larger than 45 x 45mm ane conditional) Maximum components heights 45mm Maximum payload 1kg | |
| Component supply configuration: Number of component types | Tape reel : MAX. 28 types (8mm width) Tray : MAX. 15 trays Stick | |
| Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz | |
| Air supply source | 0.45MPa or more, in clean, dry states | |
| External dimension (excluding projections) | L 880 x W1,440 x H1,445mm (Main unit only) L 880 x W1,755 x H1,500mm (When ATS15 is installed) | |
| Weight | Approx. 1,000kg (Main unit only) ATS15 : Approx. 120kg | |
- *1
- Please consult us separately for maximum board sizes.
- *2
- Consult us separately regarding component sizes outside the specifications.
- Specifications and appearance are subject to change without prior notice.
Panasonic Mounter CM402-L Modular Super High Speed placement machine
Model name: CM402-L
Substrate size: L50mm×W50mm～L510mm×W460mm
Substrate replacement time: 0.9s (when the substrate length is below 240mm and under the best conditions)
Power supply*1: three-phase AC200V, 3.5kVA
Air pressure source*2: 0.49MPa, 150L/min (A.N.R.)
Equipment size: W2350mm×D2690mm×H1430mm*3
Weight*4: 3000kg
High-speed placement head
Mounting fastest speed: 0.06s/chip (Type A)
Mounting accuracy: ±50μm/chip (Cpk≧1)
Component size: 0603 chip~L24mm×W24mm
Multifunctional placement head
Mounting fastest speed: 0.21s/QFP (Type B)
Mounting accuracy: ±35μm/QFP (Cpk≧1)
Component size: 0603 chip~L100mm×W90mm
Panasonic Mounter NPM-TT2 multifunctional production system placement machine
The Panasonic Mounter NPM-TT2 is a line configuration capable of achieving both high productivity per unit area and versatility *When directly connecting the NPM-W2, an M-size double-track conveyor belt (optional) is required. The placement head (8-nozzle placement head, 3-nozzle placement head - you can choose the general-purpose 8-nozzle placement head or the 3-nozzle placement head with special-shaped component capability) The specification of the supply part can be selected .change. By reorganizing the tray feeder/exchange trolley, the line configuration can be adapted to the component supply form. Using a multi-functional recognition camera, the recognition and inspection of the height direction of the components can be realized at a high speed, and it can carry out stable and high-speed mounting of special-shaped components) Alternate mounting and independent mounting correspondence
——(can choose the best mounting method corresponding to the production substrate)
Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine
Specifications
| S10 | S20 | |
|---|---|---|
| Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
| Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
| Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
| Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
| Board flow direction | Left to right (Std) | Left to right (Std) |
| Board transfer speed | Max 900mm/sec | Max 900mm/sec |
| Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
| Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
| Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
| Placement angle | +/-180 degrees | +/-180 degrees |
| Z axis control / Theta axis control | AC servo motor | AC servo motor |
| Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
| Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
| Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
| Drawback check | Vacuum check and vision check | Vacuum check and vision check |
| Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
| Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
| Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
| Transfer height | 900 +/- 20mm | 900 +/- 20mm |
| Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.
Reviews
There are no reviews yet.