H24 Head 0.7mm Nozzle FUJI NXT SMT Pick and place Machine
Description
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Control mode: microcomputer mode
External memory: Manage data at PT∗4. Each set of data requires about 1MB. (1 type is required for each 1 type 3.5 2HD floppy disk)
Program data: Points Max. 10000 points
CM602 power supply
Power supply for normal use: 3-phase AC 200 V/ 220 V ±10 V, 3-phase AC 380 V/ 400 V/ 420 V/ 480 V ±20 V Frequency: 50/60 Hz
Power supply for HUB ∗ 3: Single-phase AC 100 V ~ AC 240 V Frequency: 50/60 Hz
Rated capacity: main machine 4.0 kVA / HUB power supply ∗ 3: 140 VA
Supply air pressure: 0.49 MPa ~ 0.78 MPa (operating air pressure is 0.49 MPa ~ 0.54 MPa)
Supply air volume: 170 L/min (A.N.R.)
Dimensions: 2350 mm (W) × 2690 mm (D) × 1430 mm (H) (excluding 3-section signal tower and color touch panel)
quality:
Mass of the main engine: 3400 kg (140 kg for the standard configuration without the overall exchange trolley)
Overall exchange trolley mass: 140 kg (per 1)
Direct tray feeder mass: 195 kg (per 1 unit)
Standard composition mass: 3960 kg (1 main engine, 4 overall exchange trolleys)
Environmental conditions: Temperature: 10°C ~ 35°C Humidity: 25% RH ~ 75% RH (but water vapor does not condense)
Transport and storage conditions: Temperature: −20°C ~ 60°C Humidity: Below 75 % RH (but water vapor does not condense)
Altitude: from 0 m above sea level to below 1000 m
Noise: < 70dB (A)
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Yamaha 3D Hybrid Modular S10/S20 Mounter placement machine
Specifications
S10 | S20 | |
---|---|---|
Board size(with buffer unused) | Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955) | Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455) |
Board size(with input or output buffer used) | Min. L50 x W30mm to Max. L420 x W510mm | - |
Board size(with input and output buffers used) | Min. L50 x W30mm to Max. L330 x W510mm | Min. L50 x W30mm to Max. L540 x W510mm |
Board thickness | 0.4 - 4.8mm | 0.4 - 4.8mm |
Board flow direction | Left to right (Std) | Left to right (Std) |
Board transfer speed | Max 900mm/sec | Max 900mm/sec |
Placement speed (12 heads + 2 theta) Opt. Cond. | 0.08sec/CHIP (45,000CPH) | 0.08sec/CHIP (45,000CPH) |
Placement accuracy A (μ+3σ) | CHIP +/-0.040mm | CHIP +/-0.040mm |
Placement accuracy B (μ+3σ) | IC +/-0.025mm | IC +/-0.025mm |
Placement angle | +/-180 degrees | +/-180 degrees |
Z axis control / Theta axis control | AC servo motor | AC servo motor |
Component height | Max 30mm*1 (Pre-placed components: max 25mm) | Max 30mm*1 (Pre-placed components: max 25mm) |
Applicable components | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) | 0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -) |
Component package | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray | 8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray |
Drawback check | Vacuum check and vision check | Vacuum check and vision check |
Screen language | English, Chinese, Korean, Japanese | English, Chinese, Korean, Japanese |
Board positioning | Board grip unit, front reference, auto conveyor width adjustment | Board grip unit, front reference, auto conveyor width adjustment |
Component types | Max 90 types (8mm tape), 45 lanes x 2 | Max 180 types (8mm tape), 45 lanes x 4 |
Transfer height | 900 +/- 20mm | 900 +/- 20mm |
Machine dimensions, weight | L1250xD1750xH1420mm, Approx. 1,200kg | L1750xD1750xH1420mm, Approx. 1,500kg |
- *1 :
- Board thickness + Component height = Max 30mm
- Specifications and appearance are subject to change without prior notice.
High-efficiency Modular Z:LEX YSM20WR Mounter placement machine
Specifications
Model | YSM20WR |
---|---|
Applicable PCB | Dual lane Note 1 Same type PCBs: L810 x W356 to L50 x W50 Different type PCBs: up to L810 x W662 Note 2 Same type PCB: L810 x W280 to L50 x W500 Different type PCBs: up to L810 x W510 |
Head / Applicable components | High-Speed Multi (HM) Head Note 3 0201mm to W55 x L100mm, Height 15mm or less Odd-shaped components (FM: Flexible Multi) head: 03015mm to W55 x L100mm, Height 28mm or less |
Mounting capability (under optimum conditions as defined by Yamaha Motor) | X axis 2-beam Note 1: High-speed multi-purpose (HM: High-speed Multi) head x 2 81,000CPH |
Mounting accuracy | ±0.035mm (±0.025mm) Cpk≧1.0 (3σ) (under optimum conditions as defined by Yamaha Motor when standard evaluation materials are used) |
Number of component Types | Fixed plate: Max. 140 types (conversion for 8mm tape feeder) Feeder carriage exchange: Max. 128 types (conversion for 8mm tape feeder) Trays for 30 types (Fixed type: max., when fitted with sATS30) and 10 types (Carriage type: max., when fitted with cATS10) |
Power supply | 3-Phase AC 200/208/220/240/380/400/416V +/-10% 50/60Hz |
Air supply source | 0.45MPa or more, in clean, dry state |
External dimension (excluding projections) | L 1,374 x W 2,110 x H1,445mm (Main unit only) |
Weight | Approx. 2,500kg (Main unit only) |
- Note 1 : When using conveyor separation specifications of 787mm between 1 to 4 lanes
- Note 2 : When using conveyor separation specifications of 630mm between 1 to 4 lanes
- Note 3 : Please contact us for info regarding mounting 0201mm components.
- Specifications and appearance are subject to change without prior notice.
Samsuang Hanwha DECAN F2
Specifications
- Alignment
- Fly Camera, Fix Camera
- Spindle & Speed
- 2 Gantry * 10 Spindles / 80,000 CPH
- Accuracy
- ±40µm Cpk≥1.0 (0402 (01005 inch) chip) /±30µm Cpk≥1.0 (IC, Stage Vision)
- Component Range
- Fly: 0402 ~ □16 mm / Fix: ~□42 mm (Standard) / ~□55 mm (MFOV) / ~ L75 mm Connector (MFOV)
- Dimension
- L 1,430 x D 1,740 x H 1,995
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