Specification
| Board size | M size (330×250mm) | yes | |
|---|---|---|---|
| L size (410×360mm) | yes | ||
| L-Wide size (510×360mm) *1 | yes | ||
| XL size (610×560mm) | yes | ||
| Applicability to long PWB (L size)*2 | 800×360mm | ||
| Applicability to long PWB (L-Wide size)*2 | 1,010×360mm | ||
| Applicability to long PWB (XL size)*2 | 1,210×560mm | ||
| Component height | 12mm | yes | |
| 20mm | yes | ||
| 25mm(XL size) | yes | ||
| Component size | Laser recognition | 0402(01005) ~ 33.5mm×33.5mm | |
| Vision recognition | Standard camera | 3mm ~ 74mm×74mm or 50×150mm | |
| High-resolution camera | 1.0×0.5mm*3 ~ 48mm×48mm or 24×72mm | ||
| Placement speed | Chip | Optimum | 20,900CPH |
| IPC9850 | 17,100CPH | ||
| IC *4 |  9,470CPH*5 |
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| Placement accuracy | Laser recognition | ±0.05 mm (±3σ) | |
| Vision recognition | ±0.03mm(MNVC ±0.04mm) | ||
| Feeder inputs | Max.160 in case of 8mm tape (on a Electric double tape feeder)*6 |
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*1 L-Wide size is optional
*2 Applicability to long PWB is optional.
*3 KE-3020VA ： When using high-resolution camera. (option)
*4 Effective tact : The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board. (CPH=number of components placed for one hour)
*5 Estimated value when using MNVC and picking up components simultaneous with all nozzles.
.MNVC is standard in the KE-3020VA.
*6 When using Electric double tape feeder EF08HD.
* PWB size XL will be KE-3020V.
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